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Contact : Mr. He Tel: 0755-28280105 Fax: 0755-33609604 Email: sales@hhx-tech.com Address 1: 211, Building 2, Huayun Building, No. 101 Zhenxing Road, Futian District, Shenzhen Address 2: Room B07, 23rd Floor, Luxury Industrial Building, Kwai Cheung Road, Kwai Chung, New Territories, Hong Kong |
The production process of SMT mounting is very complex, and each link plays a very important role in the production process. If an error occurs in one of the links, the quality of SMT mounting products cannot be guaranteed. Therefore, let's briefly share with the editor of Kuaifa Intelligent Manufacturing, what are the quality management processes for SMT mounting production? 1. Incoming inspection Inspect the materials provided by the customer and the materials purchased by our company, compare them with the BOM provided by the customer, and ensure that there are no shortage, error, or excessive materials. 2. PCB detection For PCBs provided by customers or produced by our company, PCB quality testing will be carried out, with 100% complete testing to ensure correct PCB quality before PCB assembly. 3. First article inspection All orders need to complete the first piece production and confirmation before mass production. If there are any abnormalities in the first piece, such as material displacement, reversal, misalignment, leakage, flying, floating, false welding, solder connection, etc., we will find an engineer team to analyze the reasons and then remake the first piece. Only after detecting that there are no problems with the first piece will we proceed with subsequent mass production. 4. Online SPI Solder paste printing inspection, timely detection of printing quality deficiencies, and online SPI can visually display the effect of solder paste printing. 5. Online AOI During online AOI automatic detection, the machine automatically scans the PCB through a camera, collects images, compares the tested solder joints with qualified parameters in the database, processes the images, checks for defects on the PCB, and displays/marks the defects through a display or automatic marking. 7. X-RAY detection By utilizing the high penetration ability of X-rays, it is often used to detect and analyze changes in internal displacement of components, such as BGAs, IC chips, CPUs, etc. 8. QC inspection All boards that have completed DIP processing need to be inspected by QC to confirm whether there are any issues such as missing stickers, reverse misalignment, etc. 9. QA testing QA conducts sampling inspections, and once problems are found, all products are returned for re inspection. |
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